: This occurs when the software cannot find your connected device. Solutions include:
: The final heat spike (e.g., 220°C–245°C) to melt the solder balls.
It tracks the exact thermal history of a rework cycle to ensure quality control. Popular Software Options
Evaporates lingering moisture and prevents thermal shock/warping. achi ir6500 software
The official, basic software bundled with the machine on a mini-CD.
(safe, well-known driver archives):
: Store specific temperature settings for leaded or lead-free solders and different chip types (QFN, CSP, BGA, etc.). Monitor Real-Time Data : This occurs when the software cannot find
Watch real-time temperature slopes versus your target curves to prevent overheating.
If you've lost the original CD, search in electronics repair communities. Experienced users often archive these files. Searching for terms like "ACHI IR6500 driver download" or "IR6500 PSoft download" on forums and file-sharing sites may yield results.
The serves as the digital control center for the widely popular ACHI IR6500 dark infrared BGA rework station, enabling engineers and technicians to achieve precise, automated multi-stage thermal profiling required for complex surface-mount device (SMD) repairs. By connecting a PC to the station via a USB data cable , users transition from basic manual monitoring to precise, multi-segment computer-controlled automation. Spikes to 215°C–225°C for leaded solder
The transforms a manual heat lamp into a precision engineering tool. While the initial setup of drivers and COM ports can be a bit of a hurdle, the level of control it provides over your BGA repairs is well worth the effort.
Gradually raises the board temperature to evaporate residual moisture. Ramping rate should be 1°C to 3°C per second to prevent thermal shock.
Drafts from open windows or air conditioning units can warp your software readings. Ensure your rework station operates in a stable, well-ventilated environment.
Spikes to 215°C–225°C for leaded solder, or 235°C–245°C for lead-free solder.
Furthermore, the software’s real-time monitoring capabilities provide a safety net that manual rework cannot offer. Through the integration of thermocouples, the software constantly reads the actual temperature of the PCB surface and compares it against the programmed profile. This closed-loop feedback system is displayed dynamically on the screen, allowing the operator to see exactly how the board reacts to the infrared energy. If the temperature deviates from the safe zone, the software adjusts the power output to the heaters instantly. This feature mitigates the risk of thermal shock, a common cause of failure in electronics repair, ensuring that delicate ball grid array (BGA) chips are removed and re-balled with a high degree of reliability.