Sets boundaries for contact resistance before and after environmental stress testing. Core Components of the Specification
The standard implicitly relies on the theory of contact resistance:
The IEC 60352 series covers several types of solderless connections. Here are the other parts for context:
| Failure Mode | Root Cause | Detection per Standard | |--------------|------------|------------------------| | High initial resistance | Insulation not removed | Visual + initial R measurement | | Wire fracture at post edge | Too sharp edge radius | Microscopic inspection (non-mandatory but advised) | | Loosening under thermal cycling | Insufficient wire hardness (annealed wire) | Climatic test + pull test | | Creep relaxation | Wrong terminal alloy (pure Cu used) | Long-term damp heat | | Corrosion at interface | Incompatible plating (Ag + S environment) | Salt mist (optional extension) | iec 60352-5 pdf
IEC 60352-5 provides the universal engineering foundation necessary to execute reliable, high-performance press-in connections. By strictly following its guidelines for hole dimensions, mechanical tolerances, and rigorous qualification testing, manufacturing teams can confidently eliminate soldering defects, lower production costs, and build electronics capable of surviving the harshest operational environments.
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Here's a sample piece that demonstrates some key aspects of the IEC 60352-5 standard:
IEC 60352-5 is a standard published by the International Electrotechnical Commission (IEC) that specifies the requirements for solderless connections, specifically for insulation piercing connectors.
The standard outlines two main types of tests to ensure quality: 1. Qualification Test Schedule By strictly following its guidelines for hole dimensions,
Ensuring physical movement does not micro-fracture the compliant pin or break the gas-tight seal.
The maximum allowed force to insert the pin without damaging the board or component.
Editorial changes now clearly distinguish between the qualification test schedule (what you do once, to qualify the pin‑to‑hole system) and the application test schedule (verification for a specific product). This avoids confusion seen in earlier revisions.
Clarify the geometric differences between and their respective impacts on PCB hole plating. Let me know what you'd like to explore next ! IEC 60352-5:2020 - iTeh Standards
The standard covers board thickness, hole diameter and plating, the permissible press‑in and push‑out forces, contact resistance measurements, climatic ageing, vibration, and many other environmental influences. The latest edition (see below) expands the scope from telecommunication equipment to all kinds of electrical and electronic equipment and components.